communication circiut

the minim space between conductor trace:0.12mm thickness scope:7um to 18um Multilayer printed Through - hole printing

HIC for telecommunication Application :

1, Possess standard and special process technology including crossovers, Multilayers and Double sides/through holes for mass production ability

2, Tolerance of resistor value can be controlled in 0.05%  for passive trimming and 0.1% for active/functional trimming.

3, The temperature coefficient of resistance is less than 50ppm

4, Assembling process technology including Standard SMT, Lead-free,BGA and flip chip for mass production ability.

5, special process technology for high reliability demand.

communication circiut